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激光切割機(jī)相關(guān)的中英對(duì)照
作者：天雄激光 來源：天雄激光 時(shí)間：2019-02-23
激光切割機(jī)：laser cutting machine
激光切割機(jī)是將從激光器發(fā)射出的激光，經(jīng)光路系統(tǒng)，聚焦成高功率密度的激光束。激光束照射到工件表面，使工件達(dá)到熔點(diǎn)或沸點(diǎn)，同時(shí)與光束同軸的高壓氣體將熔化或氣化金屬吹走。隨著光束與工件相對(duì)位置的移動(dòng)，最終使材料形成切縫，從而達(dá)到切割的目的。 激光切割加工是用不可見的光束代替了傳統(tǒng)的機(jī)械刀，具有精度高，切割快速，不局限于切割圖案限制，自動(dòng)排版節(jié)省材料，切口平滑，加工成本低等特點(diǎn)，將逐漸改進(jìn)或取代于傳統(tǒng)的金屬切割工藝設(shè)備。激光刀頭的機(jī)械部分與工件無接觸，在工作中不會(huì)對(duì)工件表面造成劃傷；激光切割速度快，切口光滑平整，一般無需后續(xù)加工；切割熱影響區(qū)小，板材變形小，切縫窄（0.1mm~0.3mm）；切口沒有機(jī)械應(yīng)力，無剪切毛刺；加工精度高，重復(fù)性好，不損傷材料表面；數(shù)控編程，可加工任意的平面圖，可以對(duì)幅面很大的整板切割，無需開模具，經(jīng)濟(jì)省時(shí)。 激光設(shè)備作為一種新型的工具越來越成熟的運(yùn)用到各種行業(yè)，包含激光切割機(jī)、激光雕刻機(jī)、激光打標(biāo)機(jī)、激光焊接機(jī)等
Laser cutting is to focus the laser beam emitted from the laser into a high power density laser beam through the optical path system. The laser beam irradiates the surface of the workpiece to the melting or boiling point. At the same time, the high-pressure gas coaxial to the beam blows away the molten or gasified metal. As the beam moves with the relative position of the workpiece, the material finally forms a slit, so as to achieve the purpose of cutting. Laser cutting is the use of invisible beams of light instead of the traditional mechanical knife, with high precision, fast cutting, not limited to cutting pattern restrictions, automatic typesetting saves materials, cut smooth, low processing costs and other characteristics, will gradually improve or replace the traditional metal cutting process equipment. The mechanical part of the laser cutting head has no contact with the workpiece and will not scratch the workpiece surface during the work. The laser cutting speed is fast, the incision is smooth and smooth, generally no need for subsequent processing; Small cutting heat affected area, small plate deformation, narrow slit (0.1mm~0.3mm); No mechanical stress, no shear burr; High machining precision, good repeatability, no damage to the material surface; CNC programming, can process any plan, can be a large format of the whole plate cutting, no need to open the mold, economy and time saving. Laser equipment as a new tool more and more mature use to a variety of industries, including laser cutting machine, laser engraving machine, laser marking machine, laser welding machine
注意事項(xiàng)
操作激光切割機(jī)的注意事項(xiàng)有以下幾點(diǎn)：
1.遵守一般切割機(jī)安全操作規(guī)程。嚴(yán)格按照激光器啟動(dòng)程序啟動(dòng)激光器，調(diào)光，試機(jī)。
2.操作者須經(jīng)過培訓(xùn)，熟悉切割軟件，設(shè)備結(jié)構(gòu)、性能，掌握操作系統(tǒng)有關(guān)知識(shí)。
3.按規(guī)定穿戴好勞動(dòng)防護(hù)用品，在激光束附近必須佩帶符合規(guī)定的防護(hù)眼鏡。
4.在未弄清某一材料是否能用激光照射或切割前，不要對(duì)其加工，以免產(chǎn)生煙霧和蒸氣的潛在危險(xiǎn)。
5.設(shè)備開動(dòng)時(shí)操作人員不得擅自離開崗位或托人待管，如的確需要離開時(shí)應(yīng)停機(jī)或切斷電源開關(guān)。
6.在加工過程中發(fā)現(xiàn)異常時(shí)，應(yīng)立即停機(jī)，及時(shí)排除故障或上報(bào)主管人員。
7.要將滅火器放在隨手可及的地方;不加工時(shí)要關(guān)掉激光器或光閘;不要在未加防護(hù)的激光束附近放置紙張、布或其他易燃物。
Matters needing attention
The points for attention in operating laser cutting machine are as follows:
1. Abide by the general safety operation rules of cutting machine. Strictly in accordance with the laser start-up procedures to start the laser, dimming, trial.
2. The operator shall be trained, familiar with cutting software, equipment structure and performance, and master relevant knowledge of the operating system.
3. Wear labor protection articles according to the regulations, and wear protective glasses in accordance with the regulations near the laser beam.
4. Do not process a material without knowing whether it can be irradiated or cut with a laser to avoid the potential danger of smoke and steam.
5. When the equipment is in operation, the operator shall not leave the post or wait for the management without authorization. If it is really necessary to leave, the operator shall stop the machine or cut off the power switch.
6. If any abnormity is found in the process, the machine should be shut down immediately, and troubleshooting or report to the supervisor in time.
Keep fire extinguishers within easy reach. Do not work to turn off the laser or optical gate; Do not place paper, cloth, or other combustible materials near unprotected laser beams.
